Title : 
InP high power MISFET
         
        
            Author : 
Nagahama, K. ; Nishimura, T. ; Hayafuji, N. ; Murotani, T. ; Fujikawa, K.
         
        
            Author_Institution : 
Mitsubishi Electric Corporation, Hyogo, Japan
         
        
        
        
        
        
        
            Abstract : 
To investigate the capabilities of high frequency high power InP MISFET, the multi-finger type InP MISFETs are fabricated and their characteristics are discussed compared with those of GaAs MESFETs. Double gate-finger type InP MISFETs, whose gates are 360 µm wide, have the excellent RF output characteristics of 310 mW (0.86 W/mm) at 8 GHz with 33% power added efficiency. The 24 gate-finger type MISFETs, whose gates are 4800 µm wide, are fabricated using flip-chip bonding technique. 1.5 W output power from a chip, which is the highest value ever reported with InP MISFET, are obtained at 10 GHz with 4 dB gain.
         
        
            Keywords : 
Bonding; Capacitance-voltage characteristics; Gallium arsenide; Indium phosphide; Insulation; MESFETs; MISFETs; Power generation; Radio frequency; Thermal conductivity;
         
        
        
        
            Conference_Titel : 
Electron Devices Meeting, 1984 International
         
        
        
            DOI : 
10.1109/IEDM.1984.190676