DocumentCode :
3556346
Title :
Silicon nitride films by plasma-CVD from SiH4-N2and SiF4-N2-H2gas mixtures
Author :
Fujita, Shizuo ; Zhou, Nan-Sheng ; Toyoshima, Hideo ; Ohishi, Toshiyuki ; Sasaki, Akio
Author_Institution :
Kyoto University, Kyoto, Japan
Volume :
30
fYear :
1984
fDate :
1984
Firstpage :
630
Lastpage :
633
Abstract :
Silicon nitride films were prepared by plasma-CVD from SiH4-N2and SiF4-N2-H2gas mixtures. These films exhibited lower hydrogen concentration and higher thermal endurance than those of the films deposited from the conventional SiH4-NH3gas mixture. Improved characteristics as encapsulant of MOSFET´s and as diffusion and annealing masks suggest usefulness of these films in the field of modern microelectronics processing.
Keywords :
Etching; Hydrogen; MOSFET circuits; Optical films; Plasma applications; Plasma properties; Plasma temperature; Semiconductor films; Silicon compounds; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1984 International
Type :
conf
DOI :
10.1109/IEDM.1984.190801
Filename :
1484572
Link To Document :
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