Title :
A novel borophosphosilicate glass process
Author_Institution :
Xerox Palo Alto Research Center, Palo Alto, CA
Abstract :
A novel low cost borophosphosilicate glass (BPSG) technology suitable for one micron processing is presented here. This technique allows glass to be flowed consistently and reproducibly at temperatures as low as 750°C. Flow angles are independent of device linewidths from 1 to 10 microns. The flow angle can be adjusted by changing the deposition time. The simplicity of the process will probably enhance the reliability of the technique. Related issues such as photoresist adhesion and plasma etching have been examined. Application of this material as an interlayer dielectric in MOS circuits looks promising.
Keywords :
Adhesives; Costs; Dielectric materials; Etching; Glass; Plasma applications; Plasma devices; Plasma materials processing; Plasma temperature; Resists;
Conference_Titel :
Electron Devices Meeting, 1985 International
DOI :
10.1109/IEDM.1985.191044
