DocumentCode :
3556698
Title :
Dielectrically encapsulated trench capacitor cell
Author :
Taguchi, M. ; Ando, S. ; Higaki, N. ; Goto, G. ; Ema, T. ; Hashimoto, K. ; Yabu, T. ; Nakano, T.
Author_Institution :
Fujitsu Laboratories, Atsugi, Japan
Volume :
32
fYear :
1986
fDate :
1986
Firstpage :
136
Lastpage :
139
Abstract :
A DRAM cell with an improved trench structure, capacitor has been developed for 16M DRAMs. The capacitor is formed within a trench with polysilicon to polysilicon structure. Covering the storage electrode with the cell-plate makes this cell free from punch-through between adjacent cells. The whole capacitor is coverd with a dielectric layer and there is no interference between cells. An experimental cell was fabricated, using 4M DRAM technology. Measured data indicates that this cell is suitable for the forthcoming 16M DRAMs.
Keywords :
Capacitance; Capacitors; Dielectric measurements; Electrodes; Electronic equipment; Error analysis; Interference; Laboratories; Random access memory; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1986 International
Type :
conf
DOI :
10.1109/IEDM.1986.191132
Filename :
1486390
Link To Document :
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