Title :
Recent development in multilevel interconnect technology
Author :
Eggers, H. ; Hieber, K.
Author_Institution :
Siemens AG, Munich W-Germany
Keywords :
Dielectrics; Dry etching; Inorganic materials; Integrated circuit interconnections; Isolation technology; Logic circuits; Metallization; Organic materials; Polyimides; Testing;
Conference_Titel :
Electron Devices Meeting, 1987 International
DOI :
10.1109/IEDM.1987.191387
