DocumentCode
3557026
Title
Recent development in multilevel interconnect technology
Author
Eggers, H. ; Hieber, K.
Author_Institution
Siemens AG, Munich W-Germany
Volume
33
fYear
1987
fDate
1987
Firstpage
200
Lastpage
204
Keywords
Dielectrics; Dry etching; Inorganic materials; Integrated circuit interconnections; Isolation technology; Logic circuits; Metallization; Organic materials; Polyimides; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1987 International
Type
conf
DOI
10.1109/IEDM.1987.191387
Filename
1487345
Link To Document