Title :
A method to reduce the peak current density in a via
Author :
Lee, Keunmyung ; Voorde, P.V. ; Varon, Marty ; Nishi, Yoshio
Author_Institution :
Hewlett-Packard Co., Palo Alto, California
Abstract :
A new method to alleviate the current crowding problems in the via connect of VLSI is presented. Current crowding in advanced metal systems may cause long term reliability problems for integrated circuits because the mean time to failure due to electromigration decreases as the maximum current density increases. The FCAP3 program (three-dimensional Poisson equation solving program) is used to study current flow in three-dimensional metal structures such as vias.
Keywords :
Conducting materials; Conductivity; Current density; Current distribution; Dielectric materials; Electromigration; Integrated circuit reliability; Poisson equations; Proximity effect; Very large scale integration;
Conference_Titel :
Electron Devices Meeting, 1987 International
DOI :
10.1109/IEDM.1987.191472
