Three dimensional transient simulation of electro-thermal behavior in semiconductor devices and its applications

In this paper we deal with the solution of three dimensional transient heat-flow equation for a given arbitrary power distribution in a region with different non-linear and non-uniform thermal properties. The time dependent power distribution in the region under investigation can be given either externally or supplied by the solution of the semiconductor carrier transport equations in the electrically active sub-region. The simulator is specifically written for AIM cell programming simulations. The solution method employed in the simulator is finite-difference method using Crank-Nicolson technique for time discretization, employing multi-grid approaches. The number of equations solved for each time step is in the order of 10⁶. As a result of this work AIM cell fusing mechanism, electro-thermal interactions between neighboring cells, diffusion profile optimization issues will be covered.