3-D high-voltage CMOS ICs by recrystallized SOI merged with bulk control-unit

A three-dimensional (3-D)high-voltage flat-panel display scan driver composed of high-voltage offset-gate SOI output circuits merged with low-voltage bulk CMOS control-units has successfully been fabricated by using a CW-Ar laser recrystallization technology. The SOI high-voltage circuits are operated as a power-supply voltage of 60 ∼ 180V with an output current of more than 100mA for a channel length of 10µm and offset length of 20µm. With this technology, a monolithic integration of high-voltage output circuits and well-established low-voltage bulk VLSI can easily be realized.