DocumentCode
3557400
Title
All lead free IGBT module with excellent reliability
Author
Nishimura, Y. ; Oonishi, K. ; Morozumi, A. ; Mochizuki, E. ; Takahashi, Y.
Author_Institution
Fuji Electr. Device Technol. Co., Ltd., Matsumoto, Japan
fYear
2005
fDate
23-26 May 2005
Firstpage
79
Lastpage
82
Abstract
The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
Keywords
indium alloys; insulated gate bipolar transistors; reliability; silver alloys; solders; substrates; thermal expansion; tin alloys; IGBT module; SnAgIn; insulated substrate; lead free solder application; solder reliability; temperature cycling test; thermal expansion coefficient; Ceramics; Copper; Environmentally friendly manufacturing techniques; Insulated gate bipolar transistors; Insulation; Lead; Soldering; Temperature; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on
Print_ISBN
0-7803-8890-9
Type
conf
DOI
10.1109/ISPSD.2005.1487955
Filename
1487955
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