A fast and flexible thermal simulation tool validated on smart power devices

Author

Desoete, B. ; Moens, P. ; Gillon, R. ; Driessens, E. ; Elattari, B. ; Van den Bosch, G. ; Groeseneken, G.

Author_Institution

AMI Semicond. Belgium BVBA, Oudenaarde, Belgium

fYear

2005

fDate

23-26 May 2005

Firstpage

111

Lastpage

114

Abstract

In this paper we present a thermal simulation tool based on analytical equations, which is able to calculate temperature distributions on a die as a function of time for any number of arbitrary power sources. The tool is much faster than dedicated numerical software and offers a large flexibility to circuit designers. The results have been found to agree well with results from commercial software. Moreover, pulsed DMOS measurements have been performed in order to validate the temperature predictions.

Keywords

Green´s function methods; circuit simulation; power MOSFET; software tools; temperature distribution; analytical equations; arbitrary power sources; commercial software; numerical software; pulsed DMOS measurements; smart power devices; temperature distributions; temperature predictions; thermal simulation tool; Analytical models; Circuit simulation; Flexible printed circuits; Integral equations; Mathematical model; Performance evaluation; Predictive models; Pulse measurements; Software tools; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on

Print_ISBN

0-7803-8890-9

Type

conf

DOI

10.1109/ISPSD.2005.1487963

Filename

1487963