DocumentCode :
3557461
Title :
Ultra High Power 10 kV, 50 A SiC PiN Diodes
Author :
Das, Mrinal K. ; Hull, Brett A. ; Richmond, James T. ; Heath, Bradley ; Sumakeris, Joseph J. ; Powell, Adrian R.
Author_Institution :
Cree, Inc., Durham, NJ
fYear :
2005
fDate :
23-26 May 2005
Firstpage :
299
Lastpage :
302
Abstract :
Ultra high power 10 kV, 50 A SiC PiN diodes have been developed with a low forward voltage drop (VF) of 3.75 V and a fast reverse recovery time of 150 nsec. This is the highest reported power rating for a single SiC chip (dimensions: 8.7 mm times 8.7 mm). Furthermore, all of the historical problems with the SiC PiN diode technology such as ineffective edge termination (VBD increased to > 70% of ideal breakdown voltage), poor ohmic contacts to p-type SiC (rhoc reduced to < 10-4 Omegacm2), and forward voltage drift (DeltaVF reduced to < 0.1 V) have been solved with design, material, and process improvements which have resulted in high overall device yields. A combination of performance, reliability, and yield has the SiC PiN diode technology poised for a revolutionary impact in the world of power semiconductor devices
Keywords :
annealing; epitaxial growth; ion implantation; ohmic contacts; p-i-n diodes; passivation; power semiconductor diodes; semiconductor device manufacture; semiconductor device reliability; semiconductor materials; silicon compounds; 10 kV; 150 ns; 3.75 V; 50 A; annealing; device yield; edge termination; epitaxial growth; fast reverse recovery time; forward voltage drift; ion implantation; low forward voltage drop; ohmic contacts; p-i-n diodes; passivation; power semiconductor devices; power semiconductor diodes; semiconductor device manufacture; semiconductor device reliability; semiconductor materials; ultra high power SiC PiN diodes; Anodes; Gold; Leakage current; Ohmic contacts; Passivation; Rectifiers; Silicon carbide; Substrates; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-8890-9
Type :
conf
DOI :
10.1109/ISPSD.2005.1488010
Filename :
1488010
Link To Document :
بازگشت