DocumentCode
3557519
Title
A new sense element technology for accelerometer subsystems
Author
Cole, J.C.
Author_Institution
Silicon Designs Inc., Issaquah, WA, USA
fYear
1991
fDate
24-27 June 1991
Firstpage
93
Lastpage
96
Abstract
The author describes a capacitive accelerometer technology using sense element structures fabricated on the surface of a substrate or wafer. The sense element consists of an asymmetrically shaped flat plate of metal supported above a substrate surface by two torsion bars mounted on a central pedestal. The sense element is free to rotate around the torsion bars. Capacitor plates located on the substrate surface are used to detect the rotation. Fabrication of sense elements is done by selective electroforming in which a metal is electroplated onto a conductive substrate through a patterned photoresist layer. To produce suspended sense elements, the sense elements are fabricated partially on the top of a sacrificial spacer material deposited earlier. After the sense elements have been formed, the spacer material is then selectively etched, leaving the sense element supported only where it was formed directly on the substrate surface.<>
Keywords
accelerometers; electric sensing devices; electroforming; electroplating; integrated circuit technology; micromechanical devices; photoresists; accelerometer subsystems; asymmetrically shaped flat plate; capacitive accelerometer; capacitor plates; conductive substrate; packaging; patterned photoresist layer; sacrificial spacer material; selective electroforming; sense element technology; torsion bars; Accelerometers; Bars; Capacitance; Capacitors; Conducting materials; Nickel; Piezoresistance; Silicon; Temperature sensors; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-87942-585-7
Type
conf
DOI
10.1109/SENSOR.1991.148808
Filename
148808
Link To Document