Testing of packaging materials for improved PV module reliability

Author

Jorgensen, G.J. ; Terwilliger, K.M. ; Kempe, M.D. ; McMahon, T.J.

Author_Institution

Nat. Renewable Energy Lab., Golden, CO, USA

fYear

2005

fDate

3-7 Jan. 2005

Firstpage

499

Lastpage

502

Abstract

A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.

Keywords

adhesion; encapsulation; heat treatment; integrated circuit packaging; materials testing; moisture; photovoltaic cells; semiconductor device packaging; 85 degC; damp-heat exposure; encapsulant; improved PV module reliability; improved photovoltaic module reliability; interfacial adhesion; moisture ingress protection; moisture transport; packaging materials testing; packaging strategies; photovoltaic module packaging applications; soft backsheet materials; Adhesives; Building materials; Corrosion; Glass; Materials reliability; Materials testing; Moisture measurement; Packaging; Protection; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE

ISSN

0160-8371

Print_ISBN

0-7803-8707-4

Type

conf

DOI

10.1109/PVSC.2005.1488179

Filename

1488179