DocumentCode :
355892
Title :
Assessment of high-heat-flux thermal management schemes
Author :
Mudawar, Issam
Author_Institution :
Int. Electron. Cooling Alliance, Purdue Univ., West Lafayette, IN, USA
Volume :
1
fYear :
2000
fDate :
2000
Lastpage :
20
Abstract :
This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, micro-channel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today´s cutting edge avionics cooling schemes
Keywords :
cooling; heat sinks; military avionics; thermal management (packaging); channel flow boiling; detachable heat sink; electronic packaging; heat dissipation; high-heat-flux thermal management; jet impingement cooling; micro-channel heat sink; military avionics; mini-channel heat sink; phase change cooling; pool boiling; reliability; spray cooling; thermosyphon; Aerospace electronics; Coolants; Electronic packaging thermal management; Electronics cooling; Engineering management; Heat sinks; Spraying; Thermal engineering; Thermal management; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1089-9870
Print_ISBN :
0-7803-5912-7
Type :
conf
DOI :
10.1109/ITHERM.2000.866802
Filename :
866802
Link To Document :
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