Title :
Design for manufacturability of SISE parallel plate forced convection heat sinks
Author :
Iyengar, Madhusudan ; Bar-Cohen, Avram
Author_Institution :
Lab. of Thermal Manage. of Electron., Minnesota Univ., Minneapolis, MN, USA
Abstract :
The development of cost/effective heat sinks for microelectronic applications involves the achievement of a subtle balance between the thermal design, for maximum heat rejection, and “design for manufacturability,” for lowest material and manufacturing costs. The study reported herein extends a previously reported methodology to forced convection cooled rectangular plate heat sinks. Using a well validated analytical model, the thermofluid performance of the side-inlet-side-exit (SISE) heat sink has been characterized, parametric optimization carried out, and the maximum heat transfer capabilities for a range of operating points has been determined. A least-material optimization has been performed to achieve optimal material use. The analysis indicates the least-material design to provide significant mass savings for a moderate penalty in thermal performance. Empirical criteria for manufacturability obtained from several heat sink manufacturers lead to qualitative guidelines
Keywords :
design for manufacture; forced convection; heat sinks; SISE parallel plate heat sink; analytical model; design for manufacturability; forced convection cooling; heat transfer; least material optimization; microelectronic packaging; thermal design; Costs; Heat sinks; Heat transfer; Laboratories; Manufacturing; Resistance heating; Space heating; Thermal engineering; Thermal management; Thermal management of electronics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866820