• DocumentCode
    3559086
  • Title

    Uncooled Infrared Imaging Using a Substrate-Free Focal-Plane Array

  • Author

    Cheng, Teng ; Zhang, Qingchuan ; Wu, Xiaoping ; Chen, Dapeng ; Jiao, Binbin

  • Author_Institution
    Key Lab. of Mech. Behavior & Design of Mater., Univ. of Sci. & Technol. of China, Hefei
  • Volume
    29
  • Issue
    11
  • fYear
    2008
  • Firstpage
    1218
  • Lastpage
    1221
  • Abstract
    A substrate-free 160 times 160 focal-plane array (FPA) with a 60-mum times 60-mum pitch has been developed and used for an optical readout uncooled infrared (IR) detector. The supporting frame of the FPA is a temperature-variable one due to its large decreases in both heat capacity and thermal conductance. This thermal characteristic significantly increases the temperature change of the microcantilever, which depends on both the temperature change induced by its absorption of IR radiation and the linear superposition of the temperature prechange induced by other microcantilevers, and therefore improves the performance of the substrate-free FPA. In the proposed IR detector, the fabricated FPA had an average noise equivalent temperature difference (NETD) and a response time of 330 mK and 16 ms, respectively. Its performance increased by about 4.3 times compared with that of the substrate FPA that consists of the same microcantilevers.
  • Keywords
    focal planes; infrared detectors; infrared imaging; IR radiation; heat capacity; linear superposition; microcantilever; noise equivalent temperature difference; optical readout uncooled infrared detector; substrate-free FPA; substrate-free focal-plane array; thermal conductance; uncooled infrared imaging; Infrared detectors; Infrared imaging; Optical arrays; Optical attenuators; Optical microscopy; Optical noise; Radiation detectors; Sensor arrays; Temperature dependence; Thermal conductivity; Focal-plane array (FPA); infrared (IR) detectors; substrate-free; uncooled;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2004568
  • Filename
    4655507