• DocumentCode
    3559127
  • Title

    Effect of BTI Degradation on Transistor Variability in Advanced Semiconductor Technologies

  • Author

    Pae, Sangwoo ; Maiz, Jose ; Prasad, Chetan ; Woolery, Bruce

  • Author_Institution
    Logic Technol. Dev. Q&R, Intel Corp., Hillsboro, OR
  • Volume
    8
  • Issue
    3
  • fYear
    2008
  • Firstpage
    519
  • Lastpage
    525
  • Abstract
    The effect of PMOS transistor negative bias temperature instability (NBTI) on product performance is a key reliability concern. As technology scales and device dimensions shrink, the trend in the V T variability at both time zero and after NBTI aging increases. The time0 V T variability can be explained by the random nature of dopants, whereas the randomly generated defects in the gate oxide can account for the aging-induced device DeltaV T variability. This paper focuses on the bias temperature instability stress-induced device DeltaV T variability and the trend across several technology generations. The remarkable correlation of aging-induced DeltaV T variability to the gate oxide area suggests that the continued device geometry scaling will increase the aging-induced variability. For the first time, aging-induced DeltaV T variability was characterized on transistors fabricated with high-kappa gate dielectric that also showed similar dependence to the gate oxide area.
  • Keywords
    ageing; insulated gate field effect transistors; semiconductor device reliability; BTI degradation; advanced semiconductor technology; aging-induced device variability; bias temperature instability stress-induced device; gate oxide area; high-k gate dielectric; transistor variability; Aging; Degradation; Dielectrics; MOSFETs; Negative bias temperature instability; Niobium compounds; Random access memory; Semiconductor device reliability; Titanium compounds; Transistors; Bias temperature instability (BTI); SRAM; Vccmin; high-$ kappa$dielectrics; metal gate; transistor reliability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2008.2002351
  • Filename
    4655588