DocumentCode :
3559129
Title :
Advanced Energetic and Lateral Sensitive Charge Pumping Profiling Methods for MOSFET Device Characterization—Analytical Discussion and Case Studies
Author :
Aichinger, Thomas ; Nelhiebel, Michael
Author_Institution :
Kompetenzzenterum fur Automobil und Ind.- Elektron., Villach
Volume :
8
Issue :
3
fYear :
2008
Firstpage :
509
Lastpage :
518
Abstract :
Since it is generally accepted that interface states play an important role in MOS device degradation, measurement tools, like charge pumping (CP) gain more and more influence in interface characterization and reliability issues. In this paper, we point out that an often neglected and hardly published constant base-level technique offers more flexibility and more accuracy than a classical constant amplitude technique which provides the well-known Gaussian-like CP curve. We present both energetic and lateral sensitive profiling techniques and point out several sources of errors that can occur when CP experiments are executed. Two different energetic profiling techniques are compared by means of a case study on negative bias temperature instability. In order to determine the exact location of degradation inside the transistor channel, the seldom published but well working constant field channel modulation technique is introduced as a special feature of the constant base-level technique. The tested devices are PMOS transistors with a 30-nm SiO2 gate oxide and a gate length of 6 mum.
Keywords :
MOSFET; interface states; semiconductor device measurement; semiconductor device testing; silicon compounds; MOSFET device characterization; PMOS transistor; SiO2; constant base-level technique; constant field channel modulation; energetic profiling method; interface states; lateral sensitive charge pumping profiling method; measurement tool; negative bias temperature instability; size 30 nm; size 6 mum; transistor channel degradation; Charge measurement; Charge pumps; Current measurement; Degradation; Gain measurement; Gaussian processes; Interface states; MOS devices; MOSFET circuits; Negative bias temperature instability; Charge pumping; energetic profiling; hot carrier stress; interface states; lateral profiling; negative bias temperature instability (NBTI);
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2008.2002352
Filename :
4655590
Link To Document :
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