Thermal-mechanical models for non-conforming surface contacts

Author

Yovanovich, M.M.

Author_Institution

Dept. of Mech. Eng., Waterloo Univ., Ont., Canada

Volume

1

fYear

2000

fDate

2000

Lastpage

295

Abstract

Thermal and mechanical models for contact, gap and joint resistances are presented for non-conforming, smooth hemi-spherical surfaces. The spreading/constriction resistance relation is applicable for light mechanical loads, and the gap resistance relation was developed for gap substances such as gases, liquids and greases. The joint resistance of the interface formed by a silicon chip and a smaller aluminum heat sink was developed and an illustrative example typical of microelectronic applications was presented

Keywords

heat sinks; thermal resistance; Si-Al; aluminum heat sink; constriction resistance; contact resistance; gap resistance; grease; interface joint resistance; microelectronic system; nonconforming hemi-spherical surface contact; silicon chip; spreading resistance; thermal-mechanical model; Heat sinks; Heat transfer; Immune system; Resistance heating; Rough surfaces; Surface resistance; Surface roughness; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866838

Filename

866838