DocumentCode
355916
Title
Use of zero thickness conducting plate object in electronics cooling applications of CFD
Author
Karimanal, Kamal ; Nair, Rajesh
Author_Institution
Fluent Inc., Lebanon, NH, USA
Volume
1
fYear
2000
fDate
2000
Lastpage
313
Abstract
Zero thickness conducting plates are CFD objects that may be used to model 3 dimensional conduction in thin objects used in electronic cooling applications. The use of zero thickness conducting plates, when applicable can result in significant reduction in finite volume element count. The validity of using these thin conducting plates for CFD modeling of certain objects frequently used in electronic systems was studied using ICEPAK, a CFD software for electronics cooling application
Keywords
computational fluid dynamics; cooling; finite element analysis; heat conduction; thermal management (packaging); CFD software; ICEPAK; electronic cooling; finite element model; three-dimensional heat conduction; zero thickness conducting plate object; Application software; Boundary conditions; Computational fluid dynamics; Economic forecasting; Electronics cooling; Heat sinks; Insulation; Power generation economics; Predictive models; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1089-9870
Print_ISBN
0-7803-5912-7
Type
conf
DOI
10.1109/ITHERM.2000.866841
Filename
866841
Link To Document