Title :
Wafer Test Methods to Improve Semiconductor Die Reliability
Author :
Mann, William R.
Author_Institution :
Rockwell International (Retired)
Abstract :
Incremental advances in semiconductor device testing have improved device quality and reliability. New test methods applied to dies at the wafer level are now significantly improving the reliability of devices sold to the increasing bare-die market and reducing burn-in requirements for packaged devices.
Keywords :
semiconductor device reliability; semiconductor device testing; bare-die market; device quality; device reliability; semiconductor device testing; semiconductor die reliability; wafer test methods; Electronics packaging; Integrated circuit packaging; Manufacturing processes; Monitoring; Phase change materials; Process control; Semiconductor device packaging; Semiconductor device reliability; Semiconductor device testing; Wafer scale integration;
Journal_Title :
Design Test of Computers, IEEE
DOI :
10.1109/MDT.2008.174
