• DocumentCode
    3559316
  • Title

    Modeling, Analysis, and Application of Leakage Induced Damping Effect for Power Supply Integrity

  • Author

    Gu, Jie ; Keane, John ; Kim, Chris H.

  • Author_Institution
    Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo
  • Volume
    17
  • Issue
    1
  • fYear
    2009
  • Firstpage
    128
  • Lastpage
    136
  • Abstract
    Leakage power is becoming the dominant component of chip power consumption with continued CMOS scaling. An important but commonly unnoticed fact is that leaky transistors act as resistors that help dampen the mid-frequency power supply noise. This paper focuses on the damping effect of various on-chip current components including the leakage current which becomes significant in scaled technologies. By developing physics-based damping models for active and leakage currents, we show that leakage, particularly gate tunneling leakage, provides more damping than strong-inversion current. The proposed models were validated in a 32-nm predictive CMOS technology under process-voltage-temperature (PVT) variations. Examples on large circuits such as SRAM caches are shown to illustrate the application of the proposed model. Simulation results show that the leakage induced damping effect can compensate the speed degradation at high temperatures by 7% or offer 61% saving in decap area and leakage power.
  • Keywords
    CMOS integrated circuits; damping; integrated circuit modelling; power integrated circuits; power semiconductor devices; power supply circuits; CMOS scaling; CMOS technology; SRAM caches; gate tunneling leakage; leakage induced damping effect; leakage power; mid-frequency power supply noise; on-chip current components; power supply integrity; process-voltage-temperature variations; size 32 nm; Circuit modeling; integrated circuit (IC) design; leakage currents; power supply noise;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • Conference_Location
    12/9/2008 12:00:00 AM
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2008.2001300
  • Filename
    4703195