DocumentCode
355973
Title
A circuit-fed, tile-approach configuration for millimeter-wave spatial power combining
Author
Gouker, Mark A.
Author_Institution
Lincoln Lab., MIT, Lexington, MA, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
231
Abstract
A circuit-fed, spatially combined transmitter array is described for operation at 44 GHz. The array contains 256 elements where each element consists of a MMIC amplifier and a circularly-polarized microstrip patch antenna. The array is constructed using 16-element tile-approach subarrays, Each subarray is a two RF-level (3-D) multi-chip module (MCM) containing integrated microstrip patch antennas. The basic construction of the transmitter array resembles tile-approach phased arrays; however, the implementation has been tailored for the power combining application. The peak performance at 43.5 GHz is: EIRP of 40.6 dBW (11570 watts), effective transmitted power (Peff) of 5.9 watts, DC-to-RF efficiency of 7.3%, and system gain of 35 dB
Keywords
MMIC amplifiers; active antenna arrays; microstrip antenna arrays; millimetre wave amplifiers; millimetre wave antenna arrays; multichip modules; power combiners; transmitters; 11570 W; 35 dB; 44 GHz; 5.9 W; 7.3 percent; EHF; MM-wave spatial power combining; MMIC amplifier; RF-level 3D MCM; circuit-fed tile-approach; circularly-polarized microstrip patch antenna; millimeter-wave power combining; multi-chip module; spatially combined transmitter array; Antenna arrays; Frequency; MMICs; Microstrip antenna arrays; Millimeter wave circuits; Patch antennas; Phased arrays; Power amplifiers; Power generation; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Optoelectronics Conference, 1999. SBMO/IEEE MTT-S, APS and LEOS - IMOC '99. International
Conference_Location
Rio de Janeiro
Print_ISBN
0-7803-5807-4
Type
conf
DOI
10.1109/IMOC.1999.867097
Filename
867097
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