• DocumentCode
    355973
  • Title

    A circuit-fed, tile-approach configuration for millimeter-wave spatial power combining

  • Author

    Gouker, Mark A.

  • Author_Institution
    Lincoln Lab., MIT, Lexington, MA, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    231
  • Abstract
    A circuit-fed, spatially combined transmitter array is described for operation at 44 GHz. The array contains 256 elements where each element consists of a MMIC amplifier and a circularly-polarized microstrip patch antenna. The array is constructed using 16-element tile-approach subarrays, Each subarray is a two RF-level (3-D) multi-chip module (MCM) containing integrated microstrip patch antennas. The basic construction of the transmitter array resembles tile-approach phased arrays; however, the implementation has been tailored for the power combining application. The peak performance at 43.5 GHz is: EIRP of 40.6 dBW (11570 watts), effective transmitted power (Peff) of 5.9 watts, DC-to-RF efficiency of 7.3%, and system gain of 35 dB
  • Keywords
    MMIC amplifiers; active antenna arrays; microstrip antenna arrays; millimetre wave amplifiers; millimetre wave antenna arrays; multichip modules; power combiners; transmitters; 11570 W; 35 dB; 44 GHz; 5.9 W; 7.3 percent; EHF; MM-wave spatial power combining; MMIC amplifier; RF-level 3D MCM; circuit-fed tile-approach; circularly-polarized microstrip patch antenna; millimeter-wave power combining; multi-chip module; spatially combined transmitter array; Antenna arrays; Frequency; MMICs; Microstrip antenna arrays; Millimeter wave circuits; Patch antennas; Phased arrays; Power amplifiers; Power generation; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Optoelectronics Conference, 1999. SBMO/IEEE MTT-S, APS and LEOS - IMOC '99. International
  • Conference_Location
    Rio de Janeiro
  • Print_ISBN
    0-7803-5807-4
  • Type

    conf

  • DOI
    10.1109/IMOC.1999.867097
  • Filename
    867097