DocumentCode :
35599
Title :
A Study on the Fatigue Behavior of Anisotropic Conductive Adhesive Film
Author :
Hong Gao ; Jian Ma ; Lilan Gao ; Dong Zhang ; Jin Zhao
Author_Institution :
Sch. of Chem. Eng. & Technol., Tianjin Univ., Tianjin, China
Volume :
14
Issue :
2
fYear :
2014
fDate :
Jun-14
Firstpage :
681
Lastpage :
688
Abstract :
In this paper, the low cycle fatigue (LCF) tests were performed for anisotropic conductive adhesive films (ACFs). The effect of temperature on the tensile mechanical properties of ACFs was investigated. It was found that, with the increase in temperature, the tensile strength of ACFs decreases and its fracture strain increases resulting in lower Young´s modulus. The stress-control LCF experiments were carried out under tension-tension fatigue loading with a stress ratio of 0 <; R <; 1, which can be also called ratcheting fatigue experiments. The fatigue life decreased with an increase in stress amplitude, but it did not show significant change with an increase in mean stress. In addition, the final ratcheting strain showed an increase with respect to mean stress or stress amplitude. The effect of hygrothermal aging on the LCF of ACFs was also studied. In this case, the LCF of ACFs decreased initially and then showed an increase. In order to predict the LCF life, several methods (the modified Goodman, Gerber, and Soderberg) were considered to investigate which method is the most reasonable when mean stress is nonzero.
Keywords :
ageing; conductive adhesives; fatigue testing; mechanical properties; anisotropic conductive adhesive film; fatigue behavior; fatigue life; hygrothermal aging; low cycle fatigue tests; ratcheting strain; tensile mechanical properties; tensile strength; tension tension fatigue loading; Aging; Fatigue; Loading; Polymers; Strain; Stress; Anisotropic conductive adhesive film (ACF); fatigue life prediction; hygrothermal aging; ratcheting strain;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2014.2311124
Filename :
6767069
Link To Document :
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