DocumentCode :
3559996
Title :
Effect of Planarization on the Contact Behavior of Patterned Media
Author :
Nunez, Emerson Escobar ; Yeo, Chang-Dong ; Katta, Raja R. ; Polycarpou, Andreas A.
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana, IL
Volume :
44
Issue :
11
fYear :
2008
Firstpage :
3667
Lastpage :
3670
Abstract :
The contact behavior of patterned media was examined using a 2-D plane strain finite-element model. The maximum stresses always occurred on the lower right corner of the pattern at the edge of the contact. The effects of planarization on the resulting contact stresses for different filling materials were compared. Using a filling material resulted in a decrease of the contact stresses in the patterns since it not only made the media more robust, but it also helped in relieving the contact load on the top of the patterns. In comparing harder and softer filling materials, it was found that harder materials offer a slight advantage in alleviating the stresses.
Keywords :
finite element analysis; magnetic recording; 2-D plane strain finite-element model; contact behavior; filling material; magnetic recording; patterned media; planarization; Contacts; finite-element analysis (FEA); magnetic recording; patterned media; planarization;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2008.2002593
Filename :
4717328
Link To Document :
بازگشت