Title :
AlN: A Hexagonal-Nitride Seed Layer Underneath Ru for Granular-Type Perpendicular Magnetic Recording Media
Author :
Ishibashi, Shinichi ; Saito, Shin ; Hashimoto, Atsushi ; Takahashi, Migaku
Author_Institution :
Dept. of Electron. Eng., Tohoku Univ., Sendai
Abstract :
A new hexagonal-nitride material, AlN, is proposed in place of current metallic materials as a seed layer underneath the Ru layer for perpendicular recording media. It was found that (1) c-plane oriented AlN with wurtzite structure can be realized by direct current reactive sputtering, (2) c axis direction distribution (FWHM) of AlN decreases with the change in buffer structure from nano-crystalline to amorphous, which also results in reduction of the FWHM of Ru, (3) a Ru layer with low averaged grain size less than 8.0 nm retains low FWHM at less than 4.0deg , and surface roughness with peak to valley of 2.0 nm is available by insertion of the AlN seed layer, (4) for substrate/FeCoB buffer (10 nm)/AlN/Ru/CoPtCr-SiO2 (16 nm) media, an increase in the thickness of the AlN layer is also effective for magnetic isolation of granular-type media, in addition to a decrease in the Ru layer thickness, which means that the AlN layer can substitute a part of the Ru layer.
Keywords :
III-V semiconductors; aluminium compounds; boron alloys; buffer layers; chromium alloys; cobalt alloys; grain size; granular materials; iron alloys; perpendicular magnetic recording; platinum alloys; ruthenium; silicon compounds; sputter deposition; surface roughness; FWHM; FeCoB-AlN-Ru-CoPtCr-SiO2; amorphous structure; buffer structure; c axis direction distribution; direct current reactive sputtering; grain size; granular-type perpendicular magnetic recording media; hexagonal-nitride seed layer; layer thickness; magnetic isolation; metallic materials; nanocrystalline structure; surface roughness; wurtzite structure; Bumped topological surface; Hexagonal-nitride AlN; highly $c$ axis orientation; seed layer;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2008.2002617