Title : 
Low Phase Noise and Low Power Consumption VCOs Using CMOS and IPD Technologies
         
        
            Author : 
Hsu, Yuan-Chia ; Chiou, Hwann-Kaeo ; Chen, Hsien-Ku ; Lin, Ta-Yeh ; Chang, Da-Chiang ; Juang, Ying-Zong
         
        
            Author_Institution : 
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
         
        
        
        
        
            fDate : 
5/1/2011 12:00:00 AM
         
        
        
        
            Abstract : 
This paper presents two voltage controlled oscillators (VCOs) operating at 5.42 and 5.76 GHz implemented in 0.18-μm complementary metal-oxide semiconductor (CMOS) technology with integrated passive device (IPD) inductors. One IPD inductor was stacked on the top of the active region of the 5.76-GHz VCO chip, whereas the other IPD inductor was placed on the top of the 5.42-GHz VCO CMOS chip but far from the its active region. The high-quality IPD inductors reduce the phase noise of the VCOs. The measurements of the two VCOs indicate the same phase noise of -120 dBc/Hz at 1 MHz offset frequency. These results demonstrate a 6-dB improvement compared to the VCO using an on-chip inductor. This paper also presents the effect of the coupling between the IPD inductor and the active region of the chip on the phase noise performance.
         
        
            Keywords : 
CMOS analogue integrated circuits; inductors; phase noise; power consumption; voltage-controlled oscillators; CMOS technology; IPD technology; VCO; complementary metal-oxide semiconductor technology; frequency 5.42 GHz; frequency 5.76 GHz; integrated passive device inductor; low phase noise; low power consumption; noise figure 6 dB; size 0.18 mum; voltage controlled oscillator; CMOS integrated circuits; Inductors; Phase noise; Q factor; Substrates; System-on-a-chip; Voltage-controlled oscillators; Complementary metal-oxide semiconductor; flip-chip; integrated passive device; phase noise; voltage controlled oscillator;
         
        
        
            Journal_Title : 
Components, Packaging and Manufacturing Technology, IEEE Transactions on
         
        
        
            Conference_Location : 
5/2/2011 12:00:00 AM
         
        
        
        
            DOI : 
10.1109/TCPMT.2011.2109386