DocumentCode :
3561033
Title :
A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches
Author :
Chun, Ki Chul ; Jain, Pulkit ; Lee, Jung Hwa ; Kim, Chris H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
Volume :
46
Issue :
6
fYear :
2011
fDate :
6/1/2011 12:00:00 AM
Firstpage :
1495
Lastpage :
1505
Abstract :
Circuit techniques for enabling a sub-0.9 V logic-compatible embedded DRAM (eDRAM) are presented. A boosted 3T gain cell utilizes Read Word-line (RWL) preferential boosting to increase read margin and improve data retention time. Read speed is enhanced with a hybrid current/voltage sense amplifier that allows the Read Bit-line (RBL) to remain close to VDD. A regulated bit-line write scheme for driving the Write Bit-line (WBL) is equipped with a steady-state storage node voltage monitor to overcome the data `1´ write disturbance problem of the PMOS gain cell without introducing another boosted supply for the Write Word-line (WWL) over-drive. An adaptive and die-to-die adjustable read reference bias generator is proposed to cope with PVT variations. Monte Carlo simulations compare the 6-sigma read and write performance of proposed eDRAM against conventional designs. Measurement results from a 64 kb eDRAM test chip implemented in a 65 nm low-leakage CMOS process show a 1.25 ms data retention time with a 2 ns random cycle time at 0.9 V, 85°C, and a 91.3 μW per Mb static power dissipation at 1.0 V, 85°C.
Keywords :
CMOS memory circuits; DRAM chips; MOS integrated circuits; Monte Carlo methods; cache storage; embedded systems; integrated circuit testing; leakage currents; write-once storage; 6-sigma read and write performance; Monte Carlo simulation; PMOS gain cell; PVT variation; RWL preferential boosting; boosted 3T gain cell; circuit technique; data retention time; die-to-die adjustable read reference bias generator; eDRAM test chip; hybrid current-voltage sense amplifier; logic-compatible embedded DRAM; low-leakage CMOS process; on-die cache; power 91.3 muW; read bit-line; read margin; read speed; read word-line; regulated bit-line write scheme; size 65 nm; steady-state storage node voltage monitor; temperature 85 C; voltage 0.9 V; write bit-line; write disturbance; write word-line; Computer architecture; Couplings; MOS devices; Microprocessors; Random access memory; Simulation; Voltage control; 3T gain cell; Cache; logic-compatible eDRAM; low-power; low-voltage;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
Conference_Location :
5/5/2011 12:00:00 AM
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2011.2128150
Filename :
5763722
Link To Document :
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