• DocumentCode
    3561274
  • Title

    Petri Net Modeling and Wafer Sojourn Time Analysis of Single-Arm Cluster Tools With Residency Time Constraints and Activity Time Variation

  • Author

    Qiao, Yan ; Wu, NaiQi ; Zhou, MengChu

  • Author_Institution
    Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    25
  • Issue
    3
  • fYear
    2012
  • Firstpage
    432
  • Lastpage
    446
  • Abstract
    With wafer residency time constraints, it is crucial to schedule a cluster tool in semiconductor fabrication such that the wafer sojourn time in a processing module is in a given range. However, because of the activity time variation in wafer fabrication by cluster tools, a feasible schedule obtained under the assumption of deterministic activity times may become infeasible. To solve this problem, it is critically important to reveal the wafer sojourn time fluctuations with bounded activity time variation. This paper targets at single-arm cluster tools. They are modeled by a Petri net to describe the fabrication processes. Based on the net, a real-time control policy is proposed such that its use offsets the effect of the activity time variation as much as possible. Then, the wafer sojourn time delay is analyzed and analytical expressions are given to calculate the upper bound. With the proposed method, we can check if a given schedule is feasible under bounded activity time variation. Examples are given to show the applications of the research results.
  • Keywords
    Petri nets; cluster tools; delays; industrial manipulators; scheduling; semiconductor industry; semiconductor process modelling; Petri net modeling; bounded activity time variation; semiconductor manufacturing; single-arm cluster tools; upper bound; wafer fabrication process; wafer residency time constraints; wafer sojourn time analysis; wafer sojourn time delay; Load modeling; Manganese; Real time systems; Robots; Schedules; Semiconductor device modeling; Time factors; Cluster tools; Petri net (PN); scheduling; semiconductor manufacturing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • Conference_Location
    5/15/2012 12:00:00 AM
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2012.2199338
  • Filename
    6200351