• DocumentCode
    3564357
  • Title

    High-speed SMT compatible dispenseless underfill process for CSP BGA flip chip assembly

  • Author

    Zhang, Jian ; Baldwin, Daniel F.

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    870
  • Lastpage
    874
  • Keywords
    Assembly; Chip scale packaging; Costs; Electronics packaging; Flip chip; Manufacturing processes; Printed circuits; Soldering; Surface-mount technology; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216393
  • Filename
    1216393
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3564357