Title :
High-speed SMT compatible dispenseless underfill process for CSP BGA flip chip assembly
Author :
Zhang, Jian ; Baldwin, Daniel F.
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Chip scale packaging; Costs; Electronics packaging; Flip chip; Manufacturing processes; Printed circuits; Soldering; Surface-mount technology; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216393
