Title :
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder
Author :
Kim, Young-Bae ; Noguchi, Hiroshi ; Amagai, Masazumi
Author_Institution :
Kyushu University
Keywords :
Electronics packaging; Failure analysis; Fatigue; Frequency; Microelectronics; Optical microscopy; Stress; Temperature; Testing; Vibrations;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216397
