• DocumentCode
    3564404
  • Title

    Prediction of delamination in a Bi-material system based on free-edge energy evaluation

  • Author

    Fan, H.B. ; Yuen, Matthew M F ; Suhir, E.

  • Author_Institution
    Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    1160
  • Lastpage
    1164
  • Keywords
    Adhesives; Assembly; Bonding; Copper; Delamination; Electromagnetic compatibility; Electronic packaging thermal management; Electronics packaging; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216438
  • Filename
    1216438
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3564404