Title :
Prediction of delamination in a Bi-material system based on free-edge energy evaluation
Author :
Fan, H.B. ; Yuen, Matthew M F ; Suhir, E.
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Adhesives; Assembly; Bonding; Copper; Delamination; Electromagnetic compatibility; Electronic packaging thermal management; Electronics packaging; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216438
