• DocumentCode
    3564412
  • Title

    A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages

  • Author

    Tay, A.A.O. ; Phang, J.S. ; Wong, E.H. ; Ranjan, R.

  • Author_Institution
    National University of Singapore
  • fYear
    2003
  • Firstpage
    1165
  • Lastpage
    1169
  • Keywords
    Adhesives; Delamination; Electronic packaging thermal management; Integrated circuit packaging; Moisture measurement; Particle measurements; Polymers; Shearing; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216439
  • Filename
    1216439
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3564412