• DocumentCode
    3564599
  • Title

    When air becomes an electrical pathway

  • Author

    Umstadter, K.R. ; Millard, D.L. ; Block, R.C.

  • Author_Institution
    Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1997
  • Firstpage
    125
  • Lastpage
    126
  • Abstract
    Summary form only given. The ongoing decrease in the feature size of new printed wiring assemblies has made it more difficult to test these boards with conventional methods. We have developed a noncontact electrical test method (NCT) to replace the conventional method of potentially damaging physical contact with the desired lead. The NCT method utilizes a small volume of highly-ionized air, commonly referred to as a plasma, as a bi-directional conductive pathway. The pathway is capable of supplying or measuring current with negligible distortion. We have explored laboratory plasma properties which enhance the possibility of developing a laser NCT plasma method for wafer die features. Generating an NCT plasma is a two step process. The first step, a "multiphoton process" which occurs very quickly, governs the ignition of a plasma, We have determined the photon fluxes required for plasma generation, important because it measures the threshold of ionization of different gas volumes more accurately than the accepted irradiance calculation. Using studies of the plasma lifetime we have calculated the rate of growth of the plasma volume or probe size. The system properties necessary to generate smaller, denser plasmas have been calculated as well.
  • Keywords
    ignition; ionisation; plasma applications; plasma production by laser; plasma properties; printed circuit testing; bi-directional conductive pathway; current measurement; current supply; gas volumes; highly-ionized air; ignition; ionization threshold; multiphoton process; negligible distortion; noncontact electrical test method; photon fluxes; physical contact; plasma; plasma generation; plasma lifetime; plasma properties; plasma volume; printed wiring assemblies; probe size; wafer die features; Assembly; Bidirectional control; Contacts; Current supplies; Distortion measurement; Plasma density; Plasma measurements; Plasma properties; Testing; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1997. IEEE Conference Record - Abstracts., 1997 IEEE International Conference on
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-3990-8
  • Type

    conf

  • DOI
    10.1109/PLASMA.1997.604377
  • Filename
    604377