Title :
Optical backplanes
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
Abstract :
This paper discusses short-distance optical interconnects for distributed digital systems. We describe two-dimensional parallel optical interconnect technologies with provide connectivity across packaging layers, including chips on boards, boards in backplanes, and shelves within a bay.
Keywords :
integrated circuit packaging; optical backplanes; boards in backplanes; chips on boards; connectivity; distributed digital systems; optical backplanes; packaging layers; short-distance optical interconnects; two-dimensional parallel optical interconnect technologies; Backplanes; Digital systems; Hardware; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical transmitters; Packaging; Stimulated emission; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Fiber Communication Conference, 2000
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
1-55752-630-3
DOI :
10.1109/OFC.2000.868547
