DocumentCode :
3565050
Title :
Atomically thin graphene plane electrode for 3D RRAM
Author :
Joon Sohn ; Seunghyun Lee ; Zizhen Jiang ; Hong-Yu Chen ; Wong, H.-S Philip
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2014
Abstract :
3Å thick graphene edge was employed in the bit-cost scalable vertical RRAM structure to drastically reduce the total stack height to a single atomic layer. Two-layer 3D-stacked HfOx RRAM with graphene planar electrode (G-RRAM) is demonstrated in a 3D cross-point architecture with the edge of the graphene plane electrode serving as the bottom electrode of the RRAM. Exceptional memory window (>80×), low reset current (~20 μA), and suitable set/reset voltages (2 to 4 V) were achieved. Large memory window and low SET compliance ensures low reset current and low power consumption. Resistance components were separately measured to verify the role of graphene/oxide interface and the graphene sheet resistance. This work is a significant step toward extreme vertical scaling of 3D vertical stacked memory structures.
Keywords :
graphene devices; hafnium compounds; integrated circuit testing; integrated memory circuits; logic testing; resistive RAM; three-dimensional integrated circuits; 3D cross-point architecture; 3D vertical stacked memory structures; 3D-stacked RRAM; C; G-RRAM; HfOx; SET compliance; atomic layer; graphene edge; graphene planar electrode; graphene plane electrode; graphene sheet resistance; graphene-oxide interface; memory window; power consumption; reset current; resistance components; size 3 angstrom; stack height; vertical RRAM structure; voltage 2 V to 4 V; Arrays; Electrodes; Graphene; Hafnium compounds; Resistance; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
Type :
conf
DOI :
10.1109/IEDM.2014.7046988
Filename :
7046988
Link To Document :
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