DocumentCode :
3565092
Title :
Ge n-channel FinFET with optimized gate stack and contacts
Author :
van Dal, M.J.H. ; Duriez, B. ; Vellianitis, G. ; Doornbos, G. ; Oxland, R. ; Holland, M. ; Afzalian, A. ; See, Y.C. ; Passlack, M. ; Diaz, C.H.
Author_Institution :
TSMC, Leuven, Belgium
fYear :
2014
Abstract :
Whilst high performance p-channel Ge MOSFETs have been demonstrated [1-4], Ge n-channel MOSFET drive current has been lagging behind mainly hampered by high access resistance and poor gate stack passivation [5-9]. In this work, we address these issues on a module level and demonstrate Ge enhancement mode nMOS FinFETs fabricated on 300mm Si wafers implementing optimized gate stack (Dit <; 2×1011 eV-1·cm-2), n+-doping (Nd > 1×1020 cm-3) and metallization (ρc = 1×10-7 Ωcm2) modules. LG ~ 40 nm devices achieved Ion = 50 μA/μm at Ioff = 100 nA/um, S ~ 124 mV/dec, at VDD = 0.5V. The same gate stack and contacts were deployed on planar devices for reference. Both FinFET and planar devices in this work achieved the highest reported gm/Ssat at 0.5 V to date for Ge nMOS enhancement mode transistors to the best of our knowledge at shortest gate lengths.
Keywords :
MOS integrated circuits; MOSFET; elemental semiconductors; germanium; metallisation; optimisation; Ge; enhancement mode nMOS FinFET; metallization modules; n-channel FinFET; optimized gate stack; planar devices; shortest gate lengths; size 300 mm; voltage 0.5 V; Annealing; FinFETs; Junctions; Logic gates; Nickel; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
Type :
conf
DOI :
10.1109/IEDM.2014.7047018
Filename :
7047018
Link To Document :
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