Title :
Circuit and device interactions for 3D integration using inductive coupling
Author :
Kuroda, Tadahiro
Author_Institution :
Keio Univ., Yokohama, Japan
Abstract :
This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.
Keywords :
electromagnetic coupling; electromagnetic induction; silicon; three-dimensional integrated circuits; 3D integration; ThruChip interface; design automation; highly doped silicon via; inductive coupling; manufacturability; power delivery; CMOS integrated circuits; Coils; Couplings; Random access memory; Stacking; Three-dimensional displays; Wireless communication;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047079
