Title :
Electrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
Author :
Hsinyu Tsai ; Miyazoe, Hiroyuki ; Chang, Josephine B. ; Pitera, Jed ; Chi-Chun Liu ; Brink, Markus ; Lauer, Isaac ; Cheng, Joy Y. ; Engelmann, Sebastian ; Rozen, John ; Bucchignano, James J. ; Klaus, David P. ; Dawes, Simon ; Gignac, Lynne ; Breslin, Chri
Author_Institution :
IBM Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
In this work, we report electrical characterization FinFET devices with 29nm-pitch fins patterned using a technique called tone inverted grapho-epitaxy (TIGER). We use a topographic template to direct the self-assembly of block copolymers (BCP) to form small area gratings that are self-aligned to the template. After a tone-inversion operation, blocks of defect free SOI fins bounded by self-aligned exclude regions are formed with the spacing determined by the template line width (LW). This self-aligned customization enables further definition of the active region for FinFETs. Process window and design implications for directed self-assembly (DSA) with TIGER are also discussed.
Keywords :
MOSFET; diffraction gratings; elemental semiconductors; polymer blends; self-assembly; silicon; silicon-on-insulator; BCP; DSA; FinFET device; LW; Si; TIGER; block copolymer; defect free SOI fin; directed self-assembly; electrical characterization; self-aligned customization; self-aligned fin customization scheme; size 29 nm; small area grating formation; template line width; tone inverted graphoepitaxy; tone-inversion operation; topographic template; FinFETs; Lithography; Logic gates; Performance evaluation; Roads; Self-assembly; Silicon-on-insulator;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047152