• DocumentCode
    3565280
  • Title

    New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate Technology for the nano-reliability era

  • Author

    Pengpeng Ren ; Runsheng Wang ; Zhigang Ji ; Peng Hao ; Xiaobo Jiang ; Shaofeng Guo ; Mulong Luo ; Meng Duan ; Zhang, Jian F. ; Jianping Wang ; Jinhua Liu ; Weihai Bu ; Jingang Wu ; Waisum Wong ; Yu Shaofeng ; Hanming Wu ; Shiuh-Wuu Lee ; Nuo Xu ; Ru Huang

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2014
  • Abstract
    In this paper, a new methodology for the assessment of end-of-life variability of NBTI is proposed for the first time. By introducing the concept of characteristic failure probability, the uncertainty in the predicted 10-year VDD is addressed. Based on this, variability resulted from NBTI degradation at end of life under specific VDD is extensively studied with a novel characterization technique. With the further circuit level analysis based on this new methodology, the timing margin can be relaxed. The new methodology has also been extended to FinFET in this work. The wide applicability of this methodology is helpful to future reliability/variability-aware circuit design in nano-CMOS technology.
  • Keywords
    MOSFET; negative bias temperature instability; probability; semiconductor device reliability; FinFET; NBTI; VDD; circuit level analysis; end-of-life variability; failure probability characteristics; nanoCMOS technology; nanoreliability era; reliability-variability-aware circuit design; scaled high-κ-metal-gate technology; time 10 year; Degradation; Dispersion; FinFETs; Logic gates; Nanoscale devices; Probability; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2014 IEEE International
  • Type

    conf

  • DOI
    10.1109/IEDM.2014.7047165
  • Filename
    7047165