Title :
Agenda of conference
Abstract :
The following topics are dealt with: microsystems, packaging and materials; interconnection & 3D integration; thermal management; thermal-mechanical modeling; and advanced packaging & flexible electronics.
Keywords :
flexible electronics; integrated circuit interconnections; micromechanical devices; thermal management (packaging); 3D integration; advanced packaging; flexible electronics; interconnection; microsystems; thermal management; thermal-mechanical modeling;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048337
