Title :
Welcome message from conference chair Dr. Shen-Li Fu
Abstract :
Presents the introductory welcome message from the conference proceedings. May include the conference officers´ congratulations to all involved with the conference event and publication of the proceedings record.
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048343
