Title :
Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections
Author :
Murakoshi, Takuya ; Suzuki, Ken ; Miura, Hideo
Author_Institution :
Dept. of Nanomech., Tohoku Univ., Sendai, Japan
Abstract :
The relationship of mechanical properties and micro texture of electroplated copper thin films used for 3D interconnections was investigated using a SEM, and an EBSD method. As a result, it was found that the mechanical properties changed due to the change of the average grain size and the crystallinity of grains and grain boundaries.
Keywords :
copper; electron backscattering; electron diffraction; electroplating; grain boundaries; grain size; interconnections; metallic thin films; scanning electron microscopy; 3D interconnections; Cu; EBSD method; SEM; average grain size; crystallinity; electroplated copper thin films; grain boundary quality; mechanical properties; microtexture; Annealing; Copper; Films; Grain boundaries; Residual stresses; Temperature measurement;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048349
