DocumentCode :
3565762
Title :
Micro processing in glass substrates with pulsed CO2 lasers
Author :
Katsura, Tomotaka ; Nakamura, Reona ; Kojima, Tetsuo ; Yasui, Koji ; Saito, Yoshio
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Amagasaki, Japan
fYear :
2014
Firstpage :
329
Lastpage :
330
Abstract :
While glass is a good candidate material for interposer application, technology for formation of Through-Glass-Vias (TGVs) at high throughput and low cost is required. In this paper, we introduce micro processing technology with high-peak-power pulsed CO2 lasers which realizes high throughput at low initial and operating cost. Since the wavelength of the CO2 lasers is 9.3 microns, it is said to be difficult to drill holes with the diameters smaller than 40 microns. With a surface treatment technique of the substrate and fine tuning of the laser conditions, small holes with the diameter of 25 microns can be drilled.
Keywords :
carbon compounds; gas lasers; laser tuning; optical glass; surface treatment; CO2; TGV; fine tuning; glass substrates; high-peak-power pulsed carbon dioxide lasers; interposer application; microprocessing technology; size 25 micron; surface treatment; through glass vias; wavelength 9.3 micron; Drilling machines; Gas lasers; Glass; Laser beams; Laser tuning; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048354
Filename :
7048354
Link To Document :
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