DocumentCode
3565767
Title
New Japan material & process for LED flip chip + WL LED
Author
Onishi, T.
Author_Institution
Grand Joint Technol. Ltd., Hong Kong, China
fYear
2014
Firstpage
193
Lastpage
193
Abstract
LED Solid state lighting will become increasingly more important in the future, and high performance is required more. And new material and process is quite important for LED flip chip and wafer level LED packaging. This paper show new Japan material quick views for LED flip chip & wafer level packaging. - New Japan material & process introduction for LED high power flip chip & wafer level LED packaging; Insulation material Encapsulation material, Flip chip connection method, Plating technology.
Keywords
flip-chip devices; light emitting diodes; wafer level packaging; LED flip chip; WL LED; encapsulation material; flip chip connection method; insulation material; plating technology; solid state lighting; wafer level LED packaging; Encapsulation; Flip-chip devices; Insulation; Joints; Light emitting diodes; Materials; Japan; LED flip chip device; LED lighting; New material;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048359
Filename
7048359
Link To Document