Title :
Cu plating on film substrate by UV surface reformation treatment technology
Author :
Onitake, Shigeo ; Harada, Susumu
Author_Institution :
Koto Electr. Co., Ltd., Tokyo, Japan
Abstract :
LCP (Liquid crystal polymer) is suitable for next flexible substrate generation for high speed transmission, and COP (Cyclo Olefin Polymer) has good material performance for RF products & medical healthcare application with very lower moisture absorption, lower ion contamination, good gas barrier, good transparence and lower protein adsorption with no fluorescing. But usually those LCP & COP materials are not suitable for Cu plating with previously conventional technologies. UV surface treatment technology can apply to Cu plating onto PI, LCP &COP flexible film substrate for keeping good adhesion force with nano-anchor approaching.
Keywords :
copper; electroplating; liquid crystal polymers; substrates; surface treatment; Cu; UV surface reformation treatment technology; cyclo olefin polymer; film substrate; flexible substrate generation; high speed transmission; liquid crystal polymer; plating; Films; Glass; Radiation effects; Substrates; Surface treatment; Surface waves;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048367
