DocumentCode :
3565822
Title :
The Impact-emap 2014, 9th International conference on electronics, materials and packaging, and the 16th International symposium on electronic materials and packaging: Thesis for study analysis of memory packaging and testing industry
Author :
Hai-Teng Liu
Author_Institution :
Dept. of Ind. Eng. & Syst., Chung Hua Univ., Hsinchu, Taiwan
fYear :
2014
Firstpage :
274
Lastpage :
280
Abstract :
Taiwanese memory packaging and testing factories include Powertech, ChipMOS, ASE, SPIL, Walton and FATC. The global three first tier giants, Samsung Electronics, Hynix and Micron, have predicted that the DRAM market in 2014 will be more stable. With the three-giant monopolization taking shape, the strategic alliance and corresponding excess profits of back-end packaging factories are expected to be gradually improved. The computex new products covering semiconductors/components, green energy efficiency, Fujitsu wafer manufacturing, packaging and testing, and memories, etc. are going to take to the stage and Taiwanese IC design related firms are scrambling to grab any business opportunities. All of these will be sensationally showcased at the Taipei International Computer Show. 3D NAND will be the future trend and price competition will be the challenge of respective factories. SK Hynix and Samsung will race to launch green semiconductors, with which the information center trade will turn out to be the biggest customer. NAND Flash will march into the corporate storage market and the conventional storage trade will face a greater challenge. Fujitsu is optimistic about the demand for 4G transistors in 2014, in which the demand will be much stronger in the second half. Samsung and STMicroelectronics will expand its contract manufacturing of 28nm FD-Soi. SPIL, a packaging and testing factory, will devote its efforts to becoming the world 2nd largest packaging factory. As indicated by its president Lin Wen-Bo, as sustained by the popularity of smart phones, the demand for advanced semi-conductor packaging will continue to remain strong in 2014 which will lead to continuation of the profits. According to Korea, Times, the world number one technology giant Samsung has boasted its memory chip business, but the business has now been put to the tough test. For green energy efficiency and Taiwan´s solar power integration, Morris Chang will be the key decision maker- Google will invest 600 million US dollars in the data center at Lenoir of North Carolina, and participate in foundry services. Apple´s release of orders will offer more business opportunities, with which production of smart phones and components will expand.
Keywords :
DRAM chips; flash memories; integrated circuit design; integrated circuit packaging; integrated circuit testing; semiconductor device packaging; silicon-on-insulator; 3D NAND; 4G transistors; AD 2014; DRAM market; FD-Soi; Fujitsu wafer manufacturing; NAND Flash; Taiwanese IC design related firms; Taiwanese memory packaging; advanced semiconductor packaging; back-end packaging factories; business opportunities; data center; foundry services; green energy efficiency; green semiconductors; memory chip business; testing factories; three-giant monopolization; Companies; Consumer electronics; Industries; Materials; Packaging; Production facilities; Testing; 4G transistors; foundry services; green energy efficiency; packaging and testing factories; semiconductors/components; smart phones;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048389
Filename :
7048389
Link To Document :
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