Title :
Mechanical property analyses on power diodes in a typical 5W adapter
Author :
Zhong-Yi Wu ; Pei-Hsuan Wu ; Hu, Annie ; Kao, Jeff ; Lee, Robert ; Chen, Richard ; Chung, Harrison ; Ben-Je Lwo
Author_Institution :
Dept. of Mechatron., Energy & Aerosp. Eng., Nat. Defense Univ., Taichung, Taiwan
Abstract :
In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software were employed with the equivalent material property equations, and temperature distribution measurements were simultaneously carried out for verification and extracting boundary conditions. The simulated mechanical behaviors on the two packaging designs are finally compared with discussions in this study.
Keywords :
finite element analysis; power semiconductor diodes; semiconductor device packaging; temperature distribution; thermal management (packaging); thermal stresses; ANSYS FEM software; boundary conditions; diode packaging; equivalent material property equations; global-local methodology; mechanical property analyses; power 5 W; power adapter; power diodes; temperature distribution measurements; thermal stress analyses; thermo-stress analyses; Adaptation models; Bridges; Finite element analysis; Packaging; Schottky diodes; Stress; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048393
