DocumentCode
3565828
Title
Non etching direct patterning with any substrate
Author
Chienhan Ho
fYear
2014
Firstpage
346
Lastpage
349
Abstract
As we know Printed Circuit Board (also call rigid board or flexible board) is an etching process based product. The PCB uses copper foil to interconnect electronic components on a rigid board, fiber glass, FR4 boards, or on Polyimide Film substrate for Flexible board. The R&D team spent the past three years searching for the ideal ink to use on PCB. After three years of futile search for the ideal ink, we decided to develop our own ink. The final ink we developed utilize pre-existing screen printing technology and is suitable for electro/ electroless plating. The perfect match of the ink , Copper foil and the film substrate can fully support SMT and soldering . Numerous tests have been done to ensure the product meets the quality and market specification demand.
Keywords
copper; electroless deposition; electroplating; foils; glass; polymers; printed circuit interconnections; printed circuit testing; soldering; surface mount technology; Cu; FR4 boards; PCB; R&D team; SMT; copper foil; electroless plating; electronic components; etching process based product; fiber glass; flexible board; nonetching direct patterning; polyimide film substrate; printed circuit board; rigid board; screen printing technology; surface mount technology; Ceramics; Etching; Films; Green products; Ink; Patents; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048395
Filename
7048395
Link To Document