DocumentCode :
3565848
Title :
Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites
Author :
Min-Hua Chung ; Ping-Feng Yang ; Chiu-Wen Lee ; Chih-Ping Hung ; Hong-Ping Lin
Author_Institution :
Mater. Lab., Adv. Semicond. Eng. Inc., Nantze, Taiwan
fYear :
2014
Firstpage :
458
Lastpage :
461
Abstract :
In this study, mesoporous silica coated multi-wall carbon nanotubes (CNTs@MS) were synthesized using sodium silicate as the silica source and gelatin as the surface-activation agent. The effects of epoxy-based nanocomposites reinforced with CNTs@MS on the mechanical and thermal properties are characterized extensively using scanning electron microscopy (SEM), dynamic mechanical analysis (DMA), thermo-mechanical analysis (TMA) and thermal conductivity measurement, respectively. These results show that the mesoporous silica was integral coated on the CNTs. In addition, the storage modulus, glass transition temperature and thermal conductivity increased along with the amount of CNTs@MS (0.25, 0.5, 1.0 and 2.0 wt.%). The coefficient of thermal expansion decreased gradually, because the dipole-dipole interactions between the silica and epoxy polymer and confinement space of the mesoporous structure reduced the thermal mobility of the epoxy polymer inside the mesopore space.
Keywords :
carbon nanotubes; elastic moduli; glass transition; mesoporous materials; nanocomposites; scanning electron microscopy; silicon compounds; thermal conductivity; thermal expansion; DMA; SEM; SiO2-C; TMA; dipole-dipole interactions; dynamic mechanical analysis; epoxy-based nanocomposites; gelatin; glass transition temperature; mechanical properties; mesoporous silica coated multiwall carbon nanotubes; mesoporous structure; scanning electron microscopy; silica source; sodium silicate; storage modulus; surface-activation agent; thermal conductivity; thermal expansion coefficient; thermal mobility; thermal properties; thermo-mechanical analysis; Conductivity; Dispersion; Mechanical factors; Mesoporous materials; Polymers; Silicon compounds; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048404
Filename :
7048404
Link To Document :
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